General Specification
| ITEM | SPECIFICATIONS | UNIT |
| MODULE SIZE | 33.22 x 34.72 x 0.68 | mm |
| LTPS Glass Outline | 33.22 x 34.72 | mm |
| Encapsulation Glass Outline | 33.22 | mm |
| Number of Dot | 390 x 390 | dots |
| Active Area | 30.42 | mm |
| Diagonal Size | 1.19 | inch |
| Pixel pitch | 78*78 | um |
| Glass Thickness (LTPS Glass) | 0.2/0.2 | mm |
Interface Definition
| PIN NO. | SYMBOL | TYPE | FUNCTION DESCRIPTIONS |
| 1 | ELVSS | Power | AMOLED power Negative |
| 2 | ELVDD | Power | AMOLED power Positive |
| 3 | ELVSS | Power | AMOLED power Negative |
| 4 | ELVDD | Power | AMOLED power Positive |
| 5 | RESX | I | This signal will reset the device and must be applied to properly initialize the chip. Active low. |
| 6 | SWIRE | O | Swire protocol setting pin of Power IC |
| 7 | VPP | I | Power supply for OTP. Leave the pin to open when not in use. |
| 8 | GND | Power | The power ground |
| 9 | TE | O | Tear effect output |
| 10 | DSI_D0N | I/O | MIPI DSI data0- |
| 11 | CSX | I | SPI Enable clock |
| 12 | DSI_D0N | I/O | MIPI DSI data0+ |
| 13 | SCL | I | SPI Serial clock |
| 14 | GND | Power | The power ground |
| 15 | DCX | I | SPI CMD/Data selection signal |
| 16 | DSI_CLKN | I | MIPI DSI clock- |
| 17 | SDI | I | SPI Data Signal |
| 18 | DSI_CLKP | I/O | MIPI DSI clock+ |
| 19 | SDO | O | SPI Output signal |
| 20 | GND | Power | The power ground |
| 21 | VCI | Power | Driver IC analog supply |
| 22 | VDDIO | Power | Driver IC digital I/O supply |
| 23 | VCI | Power | Driver IC analog supply |
| 24 | VDDIO | Power | Driver IC digital I/O supply |
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